BORNICO ELECTRONICS

+48 48 365 58 22 bornico@bornico.com

Menu

Machinery park

Our machines include:

  • 2 SMD AutoTronik-SMT machines, output 6400 el/h, each machine equipped with two heads, camera, automatic board feeder, capacity to arrange components from 0201, position accuracy ±0,03 mm, maximum board dimensions 620×360, max. number of feeders – 108 units.
  • SMD Assembleon Opal-Xii eight-head machine, output 18 500el/h (13900 el/h acc. to standard IPC 9850), capacity to arrange components from 01005 to 45x100mm (BGA, uBGA, CSP), position accuracy ±50 microns for chip components and ±30 microns for QFP, max. board dimensions 460×440, maximum number of feeders – 100 units.
  • SMD Yamaha YS12F five-head machine with automatic tray changer ATS15, output 20 000el/h (14 000 el/h acc. to standard IPC 9850), capacity to arrange components from 01005 to 45x100mm (BGA, uBGA, CSP), position accuracy ±50 microns for chip components and ±30 microns for QFP, max. board dimensions 460×380, max. number of feeders – 47 units (for option with ATS15).
  • oven for reflow soldering with complete convection Heller 1809, max. board width 508 mm, nine heating zones, up-down each, two cooling zones, overall oven length 465 cm, continuous measurement and automatic correction of heating profile, KIC software.
  • oven for reflow soldering with complete convection SEHO Flowstar 4036, max. board width – 360 mm, four independent heating zones, continuous measurement in four zones (eight points), 100 programmed heating profiles, probe for recording of heating profile, complete record of parameters for standards ISO 9000
  • ERSA profile gauge, eight-channel, range of temperatures – 10-400C (measurement and calibration)
  • SEHO 1025 Pcs soldering unit with planar wave and dynamic wave for soldering SMD components, output 400 board/h, max. board width 300 mm, complete record of parameters for standards ISO 9000
  • Yamaha MCP full automatic screen printer, 3S head, dry and wet template washing, 2.5D paste application inspection; min. PCB dimensions 50×50 mm, max. PCB dimensions 510*460 mm; paste application accuracy 3 sigma at CpK > 1 25 microns, paste application repetitiveness 3 sigma at CpK > 1 5 microns
  • Dieter Metz Sr-P30/50A and Sr-P30/50AP half automatic screen printers, max. printed circuit dimensions 300×500 mm, max. print area 240×300 mm
  • MD20 dispenser for solder paste (in case of short prototype series) or adhesive application
  • PCB AOI MIRTEC MV2-HTX, instrument for board automated optical inspection, allowing testing boards or complete PCB panels, dimensions from 50×50 mm to 530×460 mm
  • conveyors, posiotioners, unloaders
  • 2 board cutting machines, including one half automatic machine
  • optical microscopes
  • soldering machines, desoldering machines, pneumatic pliers, component restraining devices
  • standard testers, gauges, programmers, oscilloscopes, laboratory power supplies
  • automatic cable and wire harness cutting machine
PolandGerman