MACHINERY

The highly specialized technological base at BORNICO currently consists of:

1) AUTOMATIC SMD MOUNTING LINES:
      • LINE 1 (output: 40’000 CPH; 28’000 CPH according to the IPC 9850 standard):

I.Fully automatic silk-screen printer – YAMAHA MCP

(3S head, wet and dry cleaning of the pattern, 2.5D paste application inspection; min. size of PCB: 50×50 mm, max. size of PCB: 510×460 mm; accuracy of applying the paste: 3 sigma for CpK>1 25 microns, repeatability of applying the paste: 3 sigma for CpK>15 microns)

II.5-head SMD automatic machine – YAMAHA YS12F – output: 20’000 CPH; 14’000 CPH (according to the IPC 9850 standard)

(components housing from 01005 to 45×100 mm (BGA, uBGA, CSP), position accuracy ± 50 microns for chip components and ± 30 microns for QFP, min. size of PCB: 50×50 mm, max. size of PCB: 510×460, max. number of 8 mm feeders: 108 pcs.)

III. 5-head SMD automatic machine – YAMAHA YS12F + ATS15 – output: 20’000 CPH ; 14’000 CPH (according to the IPC 9850 standard)

(automatic ATS15 feeder changer; components housing from 01005 to 45×100 mm (BGA, uBGA, CSP), position accuracy ± 50 microns for chip components and ± 30 microns for QFP; min. size of PCB: 50×50 mm, max. size of PCB: 510×460 mm, max. number of 8 mm feeders for the ATS15 option: 47 pcs.)

IV. Reflow soldering oven with full convection – HELLER 1809

(max. PCB width: 508 mm; 9 heating zones up-down, 2 cooling zones; total oven length: 465 cm, the continuous measurement and automatic correction of the heating profile together with KIC software)

V. Board handling and transporting devices

(line loader, standard conveyor, inspection conveyor, line unloader)

     

      • LINE 2 (output: 56’000 CPH; 34’000 CPH according to the IPC 9850 standard):

I. Fully automatic silk-screen printer – YAMAHA YCP10

(3S head, wet and dry cleaning of the pattern,  min. size of PCB: 50×50 mm, max. size of PCB: 510×460 mm; accuracy of paste application 6 sigma ± 0.025 mm, positioning repeatability 6 sigma ± 0.010 mm)

II. 10-head SMD automatic machine – YAMAHA YS12 – output: 36’000 CPH; 20’000 c CPH (according to the IPC 9850 standard)

(components housing from 01005 to 45×100 mm (BGA, uBGA, CSP), position accuracy ± 50 microns for chip components and ± 30 microns for QFP, min. size of PCB: 50×50 mm, max. size of PCB: 510×460 mm, max. number of 8 mm feeders: 108 pcs.)

III. 5-head SMD automatic machine – YAMAHA YS12F – output: 20’000 CPH; 14’000 CPH (according to the IPC 9850 standard)

(components housing from 01005 to 45×100 mm (BGA, uBGA, CSP), position accuracy ± 50 microns for chip components and ± 30 microns for QFP, min. size of PCB: 50×50 mm, max. size of PCB: 510×460 mm, max. number of 8 mm feeders: 108 pcs.)

IV. Reflow soldering oven with full convection – HELLER 1809 MK III

(min. PCB width: 85 mm, max. PCB width: 460 mm; 9 heating zones up-down, 2 cooling zones; total oven length: 465 cm, the continuous measurement and automatic correction of the heating profile together with KIC software)

V. Board handling and transporting devices

(line loader, standard conveyor, inspection conveyor, line unloader)

     

      • LINE 3 (small lot SMD production and prototypes)

I. 2 silk-screen printers DIETER METZ SR-P30/50A and SR-P30/50AP

(max. size of PCB:  300×500 mm, max. print area: 240X300 mm)

II. 2 SMD automatic machines – AUTOTRONIK-SMT – output: 6’400 CPH

(2 heads, camera, automatic PCB feeder, el. from housing 0201; position accuracy ±0.03 mm, max. size of PCB: 620×360 mm, max. number of feeders: 108 pcs.)

2) AOI AUTOMATIC OPTICAL INSPECTION DEVICES
      • AOI MIRTEC MV3 OMNI 3D

(testing boards or whole PCB panels with dimensions: 50×50 mm – 450×400 mm, 15MPx camera, 4 side cameras)

      • AOI MIRTEC MV2-HTX

(testing boards or whole PCB panels with dimensions: 50×50 mm – 530×460 mm)

3) SOLDERING DEVICES
      • Soldering unit (soldering wave) – ERSA POWERFLOW E N2 for soldering in nitrogen atmosphere

(chain transport, spray flux module, automatic melt feeder, atmosphere control; max size of PCB: 330×500 mm; lead-free soldering)

      • Soldering unit (selective wave) – ERSA ECOSELECT1 for selective soldering in nitrogen atmosphere

(automatic melt feeder, atmosphere control; max size of PCB: 508×408 mm; lead-free soldering)

      • Soldering unit (soldering wave) – SEHO 1025 PCS for lead soldering

(planar wave and dynamic wave for soldering SMD components)

     

4) EQUIPMENT FOR CLEANING AND CONFORMAL COATING
      • Automatic PCB washing system – COMPACLEAN version III

(two-stage rinsing process, improved drying process, ionic purity testing)

      • Selective coating machine (selective application of protective coatings) – AEB ROBOTICS TWIN COAT
        (2 Nordson EFD heads/valves; coarse and precise painting)

 

5)  MANUAL ASSEMBLY STATIONS
      • 15 stations for THT and manual assembly

   

6) ADDITIONAL EQUIPMENT
      • ERSA profile gauge – 8-channel; temperature range: 10-4000C
      • climatic cabinet for storing electronic components
      • 2 devices for cutting boards (1 semi-automatic)
      • optical microscopes
      • soldering guns, de-soldering guns
      • pneumatic pliers, devices for restraining components
      • needle testers, meters, programmers, oscilloscopes, laboratory power supplies
      • device for automatic cutting cables and cable bundles

 

© 2019 BORNICO Electronics