Pick & Place
Our advanced SMT assembly lines deliver maximum precision and speed for high-density layouts. We guarantee high throughput and perfect solder paste application, allowing seamless transitions from fast-turn prototypes to high-volume production.
- Component Range: From miniature 0201 chips to complex BGA, μBGA, and QFN integrated circuits.
- Precision Stencil Printing: High-accuracy automated Yamaha solder paste printers with continuous alignment checks.
- Controlled Reflow: Multi-zone Heller ovens ensuring an optimal and highly stable thermal profile for lead-free soldering.