AOI and X-RAY
Our multi-stage quality assurance workflow drives our defect rate down to an exceptional 0.001%. Through advanced non-destructive inspection technologies, we verify that every single board is fully functional before shipment.
- 3D AOI Inspection: Automated optical systems that verify component presence, polarity, and joint quality in three dimensions.
- X-Ray Analysis: Deep-layer radiography to inspect hidden solder points beneath BGA balls, QFN pads, and heat sinks.
- Electrical Testing: In-circuit (ICT) and flying probe testing to validate electrical continuity and correct component values.