In order to increase production capacity and increase flexibility, BORNICO has launched:
THE New LINE for SMD (SMT) assembly!
The new line include:
- fully automatic Yamaha YCP10 silk-screen printer with the 3S head, dry and wet template washing; the minimum PCB size is 50×50 mm, maximum PCB size is 510×460 mm; accuracy of paste application of 6 sigma ±0.025 mm, positioning repeatability of 6 sigma ±0.010 mm;
- 10-head Yamaha YS12 SMD automatic machine with the output of 36’000 el/h (20’000 el/h according to the IPC 9850 standard) with the possibility of arranging components from 01005 to 45×100 mm (BGA, uBGA, CSP), position accuracy ±50 microns for chip components and ±30 microns for QFP, the minimum PCB size is 50×50 mm, the maximum PCB size is 510×460, the maximum number of feeders – 108 8 mm;
- 5-head Yamaha YS12F SMD automatic machine with the output of 20’000 el/h (14’000 el/h according to the IPC 9850 standard) with the possibility of arranging components from 01005 to 45×100 mm (BGA, uBGA, CSP), position accuracy ±50 microns for chip components and ±30 microns for QFP, the minimum PCB size is 50×50 mm, the maximum PCB size is 510×460, the maximum number of feeders – 108 8 mm;
- Reflow soldering oven with full convection Heller 1809 Mk III, the minimum PCB width is 85 mm, the maximum PCB width is 46 mm, 9 heating zones – every up-down, 2 cooling zones, the total oven length is 465 cm, the continuous measurement and automatic correction of the heating profile together with KIC software;
- The device transporting the PCB in the line.
Launching the line will significantly increase the efficiency and flexibility of SMD assembly, which will certainly translate into even better handling of our customers’ orders.
